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PERFORMANCE SPECIFICATION

FOR

SHARED RECONNAISSANCE POD (SHARP)

IMAGING SENSORS

TABLE OF CONTENTS

1. SCOPE *

1.1 Scope *

1.2 Classification *

2. APPLICABLE DOCUMENTS *

2.1 General *

2.2 Government documents *

2.2.1 Specifications, Standards and Handbooks *

2.2.2 Other Government Documents, Drawings and Publications *

2.3 Non-Government Publications *

3. REQUIREMENTS *

3.1 General *

3.1.1 Equipment Definition *

3.1.2 Key Performance Parameters *

3.2 First Article – TBD *

3.3 Materials *

3.4 Performance characteristics *

3.4.1 Imaging requirements *

3.4.1.1 High altitude imaging requirements *

3.4.1.1.1 Field of coverage *

3.4.1.1.2 Field of regard *

3.4.1.1.3 Sensor pointing *

3.4.1.2 Medium altitude imaging requirements *

3.4.1.2.1 Field of coverage *

3.4.1.2.2 Field of regard *

3.4.1.2.3 Sensor pointing *

3.4.1.3 Image Quality *

3.4.1.4 Stabilization *

3.4.1.5 Imaging Conditions *

3.4.1.6 Target Characteristics *

3.4.2 Logistics and Readiness *

3.4.2.1 General *

3.4.2.2 Reliability, Maintainability, and Operational Availability *

3.4.2.2.1 Reliability *

3.4.2.2.2 Operational Availability (AO) *

3.4.2.2.3 Durability *

3.4.2.2.4 Maintainability *

3.4.2.2.5 Weapon Replaceable Assembly Moisture *

3.4.2.3 BIT Performance *

3.4.2.3.1 Failure Detection *

3.4.2.3.2 Failure Isolation *

3.4.2.3.3 BIT False Alarms *

3.4.2.3.4 BIT Tolerance and Filtering *

3.5 Interface definition *

3.5.1 Physical interface TBD Raytheon *

3.5.2 Electrical power Interface – TBD – (Mel) *

3.5.3 Optical interface – TBD – (Mel) *

3.5.4 Data interfaces *

3.5.4.1 Imagery data interfaces *

3.5.4.1.1 Full resolution imagery data interface – TBD – (Dale LinneVonBerg/Mike Colbert) *

3.5.4.1.2 Reduced resolution imagery data interface – TBD - (Dale LinneVonBerg/Mike Colbert) *

3.5.4.2 Navigation data interface – TBD- (Dan Crabtree) *

3.5.4.3 Sensor pointing data interface – TBD – (Raytheon – Indy) *

3.5.4.4 Sensor command and control interface – TBD – (Dale LinneVonBerg/Mike Colbert) *

3.5.4.5 BIT requirements *

3.5.4.5.1 General *

3.5.4.5.2 BIT Interfaces *

3.5.4.5.3 Fault Logs *

3.5.4.5.4 Elapsed Time Indication *

3.6 Environmental Conditions *

3.6.1 Operational Flight Envelope *

3.6.2 Aircraft Maneuvering Environment *

3.6.3 Sensor Bay Environment *

3.6.3.1 Temperature – TBD – (Raytheon – Indy) *

3.6.3.2 Temperature shock – TBD – (Raytheon – Indy) *

3.6.3.3 Humidity – TBD – (Raytheon – Indy) *

3.6.3.4 Shock – TBD – (Raytheon – Indy) *

3.6.3.4.1 Service Shock. *

3.6.3.4.2 Crash Safety Shock. *

3.6.3.5 Vibration – TBD – (Raytheon – Indy) *

3.6.3.6 Acoustic Noise – TBD – (Raytheon – Indy) *

3.6.3.7 Fungus *

3.6.4 Electromagnetic Compatibility – TBD – (NAWCAD EMC Branch, 5.1.7.1) *

3.6.4.1 Emission and Susceptibility Requirements. *

3.6.4.1.1 MIL-STD-461 Requirements *

3.6.4.1.2 Subsystem Test *

3.6.4.1.3 Specific MIL-STD-461 Requirements *

3.6.4.2 Relay Transient Immunity *

3.6.4.3 Ground Plane Noise Immunity *

3.7 Physical Characteristics – TBD *

3.7.1 Electrical – TBD *

3.7.2 Thermodynamics – TBD *

3.7.3 Weight – TBD – (Raytheon – Indy) *

3.7.4 Installation – TBD – (Raytheon – Indy) *

3.7.5 Grounding, balancing, and interconnect requirements – TBD - (NAWCAD EMC Branch, 5.1.7.1) *

3.7.5.1 Grounding Requirements *

3.7.5.1.1 Aircraft Grounding *

3.7.5.1.2 3.3.2.3.2 Primary Power Grounding. *

3.7.5.1.3 Signal Grounding. *

3.7.5.1.4 Shield Grounding *

3.7.5.1.5 Component Grounding *

3.7.5.1.6 Interconnect Wire Shielding *

3.7.5.1.7 DMS A/C Bonding Requirement *

3.7.5.1.8 3.3.2.3.8 Device Sensitive to Electrostatic Discharge. *

3.7.6 Aerodynamics – TBD *

3.7.7 Survivability – TBD *

3.7.8 Design and Construction – TBD *

3.7.8.1 Materials, Processes and Parts. *

3.7.8.1.1 Materials. *

3.7.8.1.2 Processes *

3.7.8.1.3 Parts *

3.7.9 Equipment identification – TBD *

3.7.10 Interchangeability – TBD *

3.7.11 Color – TBD *

3.8 Integrated Logistics and Support *

3.8.1 Support Equipment *

3.8.2 Storage Containers *

3.9 Safety *

3.10 Security *

3.11 Information Security *

3.12 Human Factors Engineering - TBD *

3.13 Non-development Items – TBD *

4. VERIFICATION – TBD *

4.1 General *

4.2 Inspections *

4.3 Physical characteristics *

4.3.1 Physical dimensions *

4.3.1.1 Weight *

4.3.1.2 Mounting interface *

4.3.1.3 Grounding *

4.3.1.4 Safety *

4.3.1.5 Physical security *

4.3.1.6 Sensor optical characteristics *

4.4 Performance tests *

4.4.1 Electrical Interface tests *

4.4.2 Environmental tests *

4.4.3 Imaging performance *

5. PACKAGING *

6. NOTES *

6.1 Intended Use *

6.2 Acquisition Requirements *

  1. SCOPE
    1. Scope
    2. This specification covers a reconnaissance sensor(s) which will be installed in a Shared Reconnaissance Pod (SHARP) mounted on an F/A-18E/F aircraft. The SHARP system on the F/A-18E/F will replace the existing F-14 Tactical Airborne Reconnaissance Pod System currently deployed by the USN.

    3. Classification
  2. APPLICABLE DOCUMENTS
    1. General
    2. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements documents cited in sections 3 and 4 of this specification, whether or not they are listed.

    3. Government documents
      1. Specifications, Standards and Handbooks
      2. The following specifications, standards and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation (see 6.2).

        MIL-E-5400T Military Specification, Electronic Equipment, Aerospace General Specification For.

        MIL-STD-704E Military Standard, Aircraft Electrical Power

        MIL-STD-2500B National Imagery Transmission Format Standard 2.1

        MIL-STD-1760C(1) Military Standard, Aircraft/Store Electrical Interconnection System, dated 2 March 1999

        MIL-E-6051D(1) Electromagnetic Compatibility Requirements, Systems

        MIL-STD-810E(3) Shock and Vibration, dated 31 July 1995

        MIL-HDBK-310 Global Climatic Data for Developing Military Products, dated 23 June 1997

        (Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094)

      3. Other Government Documents, Drawings and Publications

      The following other Government documents, drawings, and publications form a part of this document to the extent specified herein. Unless otherwise specified, the issues are those cited in the solicitation.

    4. Non-Government Publications
  3. REQUIREMENTS
    1. General
    2. The U. S. Navy requires an organic, all-weather, day/night, manned, tactical air reconnaissance capability to provide continuous and immediate intelligence support to the Battle Group Commander (BGC) in the prosecution of independent, joint, or combined operations as well as to provide intelligence data for the security of those forces under his/her command. This capability is required to replace the F-14 Tactical Air Reconnaissance Pod (TARPS) capability, scheduled for phase-out in FY03. To meet this requirement, the Department of the Navy will incorporate a SHAred Reconnaissance Pod (SHARP) on the centerline of the F/A-18E/F that will employ a suite of sensors to collect infrared, visible, and synthetic aperture radar (SAR) digital imagery at medium and high altitudes. The required capability described herein must be supportable within the capability of the deployed carrier air wing or the F/A-18E/F aircraft forward deployed support posture. The complete airborne reconnaissance system must employ digital technology and be compatible with Common Imagery Ground/Surface System (CIG/SS) compliant ground stations. The reconnaissance system must include overflight and standoff capability in both day and night conditions. The full range of reconnaissance capability may be provided through separate and interchangeable medium and high altitude sensors that can be easily reconfigured into optimum mission suites. However, a single sensor that could meet both medium and high altitude requirements is desirable. To ensure true multi-mission capability of the F/A-18E/F aircraft the SHARP pod must be capable of being installed or removed with full mission turnaround capability of less than one hour.

      This specification defines the requirements for the visible and infrared imaging reconnaissance sensors to be incorporated in the SHARP system.

      1. Equipment Definition
      2. The SHARP sensor suite shall consist of a sensor or sensors capable of operating in the visible and Infrared portions of the spectrum as defined herein, and such other equipment necessary to interface the sensors with the SHARP pod, the recording medium, and the data link system.

      3. Key Performance Parameters

      Key Performance Parameters are shown in table I. For design purposes, all National Imagery Interpretability Rating Scale (NIIRS) resolution requirements shall be computed as being that spatial resolution at the exact midpoint of each NIIRS scale level.

      TABLE I. Key performance Parameters

      Requirement

      Threshold

      Objective

      Resolution, Med Alt Overflight, Visible

      VIS NIIRS 6

      VIS NIIRS 7

      Resolution, Med Alt Overflight, Infrared

      IR NIIRS 5

      IR NIIRS 6

      Resolution, Med Alt Standoff, Visible

      VIS NIIRS 4

      VIS NIIRS 5

      Resolution, Med Alt Standoff, Infrared

      IR NIIRS 3

      IR NIIRS 4

      Resolution, High Alt Standoff, Visible

      VIS NIIRS 5

      VIS NIIRS 6

      Resolution, High Alt Standoff, Infrared

      IR NIIRS 4

      IR NIIRS 5

      Operational Availability (SHARP System)

      0.70

      0.85

       

    3. First Article – TBD
    4. Materials, processes, and parts
    5. Materials, processes and parts used in the manufacture of the SHARP sensors shall be of high quality, suitable for the purpose, and shall conform to applicable Government and commercial specifications. All materials used shall be fungus inhibiting

    6. Performance characteristics
      1. Imaging requirements
      2. The sensor imaging requirements are summarized in table II, and described in the following paragraphs. Imaging performance requirements shall be met throughout the operating and maneuvering environments specified in section 3.7, for the three mission scenarios described in appendix TBD.

        TABLE II. Imaging Requirements

        Requirement

        Threshold

        Objective

        Medium altitude standoff, visible, maximum slant range (along optical centerline)

        15nm

        20nm

        Medium altitude standoff, infrared, maximum slant range (along optical centerline)

        15nm

        20nm

        High altitude standoff, visible, maximum slant range (along optical centerline)

        45nm

        50nm

        High altitude standoff, infrared, maximum slant range (along optical centerline)

        25nm

        30nm

        Resolution, overflight, visible

        VIS NIIRS 6

        VIS NIIRS 7

        Resolution, overflight, infrared

        IR NIIRS 5

        IR NIIRS 6

        Resolution , medium altitude standoff, visible

        VIS NIIRS 4

        VIS NIIRS 5

        Resolution , medium altitude standoff, infrared

        IR NIIRS 3

        IR NIIRS 4

        Resolution , high altitude standoff, visible

        VIS NIIRS 5

        VIS NIIRS 6

        Resolution , high altitude standoff, infrared

        IR NIIRS 4

        IR NIIRS 5

        Field of regard, medium altitude, visible/infrared

        (wingtip-to-wingtip through nadir)

        180 deg

        N/A

        Field of regard, high altitude standoff, visible/infrared

        Horizon-to-45 deg depression (left & right sides)

        180 deg

        (wingtip-to-wingtip through nadir)

         

        1. High altitude imaging requirements
          1. Field of coverage
          2. The sensor(s) shall provide an effective cross-track field of coverage of no less than 3 degrees, and continuous coverage along the line of flight, with no holidays. It is desired that the sensor(s), when operated at non limiting v/h values, be capable of correspondingly larger cross track coverage. This requirement shall be attained throughout the high altitude operating envelope described in table IV and at all standoff ranges up to the maximum specified for the high altitude mission in table II. Field of coverage is defined as the angular coverage regardless of the sensor’s lens/FPA instantaneous field of view.

          3. Field of regard
          4. The sensor’s field of regard shall be from the horizon to a depression angle of 45 degrees below the horizon on both the left and right sides of the aircraft. A horizon to horizon field of regard (through nadir below the aircraft) is desired. Obscuration due to aircraft structure or ordnance shall be allowed.

          5. Sensor pointing
            1. Pointing accuracy
            2. The sensor(s) pointing accuracy shall be within + 10 percent of the sensor angular coverage, as defined in paragraph 3.4.1.1.1.

            3. Minimum slew rate
            4. The sensor(s) minimum slew rate shall be sufficient to maintain the pointing accuracy specified herein.

            5. Maximum slew rate

          The sensor(s) maximum slew rate shall not exceed 100 degrees per second.

        2. Medium altitude imaging requirements
        3. Unless otherwise stated, the following requirements apply to both the medium altitude overflight and medium altitude standoff missions.

          1. Field of coverage
          2. The sensor shall provide an effective cross-track field of coverage of 20 degrees, and continuous coverage along the line of flight, with no holidays. It is desired that the sensor(s), when operated at non limiting v/h values, be capable of correspondingly larger cross track coverage. This requirement shall be attained throughout the medium altitude sensor operating envelope in table IV and at all standoff ranges up to the maximum specified for the high altitude mission in table II. Field of coverage is defined as the angular coverage regardless of the sensor’s lens/FPA instantaneous field of view.

          3. Field of regard
          4. The sensor’s field of regard shall be 180 degrees, from horizon to horizon through nadir below the aircraft. Obscuration due to aircraft structure or ordnance shall be allowed. .

          5. Sensor pointing
            1. Pointing accuracy
            2. The sensor(s) pointing accuracy shall be within + 10 percent of the sensor angular coverage, as defined in paragraph 3.4.1.2.1.

            3. Minimum slew rate
            4. The sensor(s) slew rate shall be sufficient to maintain the pointing accuracy specified herein.

            5. Maximum slew rate

          The sensor(s) maximum slew rate shall not exceed 100 degrees per second.

        4. Image Quality
        5. Stabilization
        6. The sensor(s) shall be stabilized as required to meet the imaging performance and pointing accuracy specified herein throughout the "full performance" maneuvering envelope specified in table V, including aircraft buffeting due to air turbulence. Additionally, the stabilization shall correct for aircraft roll displacements of up to 30 degrees, and pitch and yaw displacements of up to 10 degrees.

        7. Imaging Conditions
        8. The medium and high altitude, visible and infrared imaging performance requirements shall be attainable in a clear air mass, which is free of visible/infrared imagery obscurants, such as rain, fog, smoke, clouds, blowing sand etc… For the purposes of design, performance shall be referenced to a Modtran 3.7, Tropical atmosphere model, using the Navy Maritime aerosol model. The specified medium and high altitude visible imaging performance shall be attainable at sun angles of not less than 10° . The specified medium and high altitude infrared imaging performance shall be attainable from one hour after to one hour before the thermal cross-over points. Graceful degradation of performance is allowable outside these ranges.

        9. Target Characteristics

        Targets shall be representative of the appropriate NIIRS scale for particular missions. The thermal contrast between a target and its background shall be 4 centigrade degrees. The visible contrast between a target and its background shall be TBD as defined by TBD.

      3. Logistics and Readiness
        1. General
        2. The logistics and readiness requirements, including reliability and maintainability requirements are summarized in table III and described in more detail in subsequent paragraphs.

          TABLE III. Logistics and Readiness Requirements

          Requirement

          Threshold

          Objective

          Reliability: Mean Operating Hours Between Operational Mission Failure (MFHBOMF)1

          75

          100

          Maintainability: Mean Corrective Maintenance Time for Operational Mission Failures (MCMTOMF)2<<tjo—need to specify whether O-level or I-level, or separate categories for both. I assume for sensor(s) there will be no O-level corrective maintenance, just I and D level. And I level may be just to remove and replace the sensor, to send the sensor back to depot for further repair>>

          1 hour

          45 mins

          Mean Operational Hours Between Unscheduled Maintenance Action (MFHBUMA)3

          50

          75

          BIT Percent Correct Detection4

             

          BIT Percent Correct Fault Isolation5

             

          Mean Operating Hours Between False BIT Indication (MFHBFBI)6

             

          Operational Availability

          0.80

          0.90

           

        3. Reliability, Maintainability, and Operational Availability
        4. The equipment shall be designed to meet the reliability requirements specified below throughout the service life of the equipment when operated as specified herein. These reliability requirements shall take into account manufacturing variability, component variability, component drift, test equipment accuracy, functional performance limits, operating environment influence and equipment aging.

          1. Reliability
          2. The equipment, when operated in any combination of modes and natural environments, shall achieve a Mean Time Between Failure (MTBF) of greater than or equal to 1050 hours. . The predicted MTBF based on MIL-HDBK-217 or industrial standard alternative predictions shall exceed hours by a factor of 1.67.

          3. Operational Availability (AO)
          4. The equipment, when operated in any combination of modes and natural environments, shall achieve a system Operational Availability (AO) of 98%.

          5. Durability
          6. The equipment shall be capable of withstanding the derived service life operational usage environments (thermal, vibration, power cycling, CATS/Traps). The extreme environmental envelope shall not exceed the worst case operational limits as defined in paragraph XXXXX.

          7. Maintainability
          8. The equipment shall be maintainable for the service life and design usage specified herein and shall meet the following maintainability requirements.

             

            1. Mean Time To Repair (MTTR)
            2. The O-level MTTR required to meet operational objectives is 90 minutes for sensors. This includes all aircraft level actions, including a maximum OFP loading time of TBD minutes, maximum declassification time of TBD minutes, and no logistics delays.

              The equipment shall meet the MTTR and maximum repair time requirements at the Organizational Level (O-level), Intermediate Level (I-level) and Depot Level (D-level), including aircraft and equipment access times, as specified in table XX.

              Table XX. Sensor repair times

              Maintenance Level

              Mean Time To Repair

              Max Repair Time At 95th Percentile

              Organizational

              TBD hours

              TBD hours

              Intermediate

              TBD minutes

              TBD hours

              Depot

              TBD minutes

              TBD hours

               

            3. Design for maintenance
            4. The equipment shall be designed so that maintenance (O-level) and decontamination can be conducted by personnel wearing chemical/biological protective clothing. The equipment shall be maintainable by the 5th percentile female and 95th percentile male.

            5. Adjustments and Alignments
            6. There shall be no maintenance adjustments or alignments required at the sensor level for the equipment to meet its performance requirements. Any maintenance adjustments and alignments shall occur only during depot repair.

            7. Modular Design

            The equipment shall be designed to utilize modular space assignment. Each sensor shall be designed and constructed for repair by simple replacement of SRAs. Each sensor shall be comprised of SRAs.

          9. Weapon Replaceable Assembly Moisture

          Sensors shall be designed to minimize the collection of moisture.

        5. BIT Performance
        6. BIT performance requirements apply to the complete set of BIT functions as defined herein.

          1. Failure Detection
          2. Failure Detection (FD) is defined as the ability of the sensor BIT to recognize a Failure and record it in accordance with 3.2.1.4.7 or to not communicate on the MUX bus during a "dead box" failure. Sensor ORT plus PBIT shall be capable of detecting 90% of all Failures. Sensor ORT tests plus PBIT tests plus IBIT tests shall be capable of detecting 98% of all Failures. The percentage of correct detections is the number of correct detections divided by the total number of confirmed faults times 100 (to express the quotient as a percent).

            Dead Box Failures If the equipment is not capable of transmitting valid BIT status information on the MUX bus, it shall suppress 1553 communications. Dead Box failures shall be included in the failure detection percentages.
          3. Failure Isolation
          4. BIT shall correctly isolate 99 percent of detected failures to the faulty sensor. The percentage of correct fault isolations is the number of correct fault isolations (to a faulty sensor) divided by the number of correct detections times 100.

            The Supplier shall not be responsible for BIT ambiguities resulting from open circuits, short circuits, and grounds in interconnecting harnesses external to the equipment, but is encouraged to design to eliminate these ambiguities.

          5. BIT False Alarms
          6. The BIT False Alarm Rate is defined as the number of BIT False Alarms divided by the number of Detected Failures. The equipment False Alarm Rate shall not exceed 5%. A BIT false alarm occurs when BIT identifies and logs a failure in the fault log that subsequently cannot be duplicated at organizational level maintenance, intermediate level maintenance or at the depot. Note that removals due to visual indications that cannot be duplicated at the depot are not included in the BIT false removal rate.

             

          7. BIT Tolerance and Filtering

To preclude false Failure indications, each signal (function, parameter, etc.) shall have a corresponding accept/reject criteria that must be met before an equipment failure is indicated. The equipment design shall be such that upon recovery from a failed state each signal (function, parameter, etc.) shall return to a GO state within 1.0 second.

The supplier is responsible for all aspects of the BIT design which affect the BIT false removal rate, while adhering to the criteria for a failure, including the following:

  1. BIT stimulus and measurement precision.
  2. Accept/reject limit of each test (worse case variations of performance resulting from manufacturing tolerances, age induced drift, environmental induced shifts, and possible failure modes).
  3. Persistence time that each accept/reject limit must be exceeded before an equipment failure is indicated.
  4. Transient conditions in the aircraft, including those associated with primary power, switching, environmental conditions, and RF noise.
  5. Interfacing equipment turned off, booting up, or in self recovery mode.
  6. Verticality between BIT and depot testing, including BIT test voids.

 

    1. Interface definition
      1. Physical interface
      2. The sensor imaging unit shall operate within the rotating center section of the SHARP pod, which provides a cylindrical volume 49.45 inches long and 20.8 inches in diameter. The sensor imaging unit, with stabilization system, shall be mounted at each end bulkhead. Additional WRAs shall be mounted within ___ volumes in the forward and aft avionics bays of the SHARP pod, measuring __________________ respectively. Detailed drawings of these volumes are in ________________.

      3. Electrical power Interface – TBD
      4. Optical interface – TBD

The sensor(s) shall attain full imaging performance while imaging through a window mounted in the rotating center section of the pod. The inner surface of the window will be 10.9 inches from the centerline of the center section. The window will designed as follows:

  1. Material:
  2. Height:
  3. Width:
  4. Thickness
  5. Flatness:
  6. Wedge:
  7. TBD

 

      1. Data interfaces
        1. Imagery data interfaces
        2. The sensor shall provide full resolution imagery for archive on the digital storage system, and reduced resolution imagery for cockpit viewing as specified below.

          1. Full resolution imagery data interface – TBD
          2. The full resolution image format shall be NITFS 2.1

            …A SHARP Display Station-Afloat (SDS-A) and a SDS-Ground (SDS-G) will be developed to support aircrew training, validate mission results and target verification, and support maintenance personnel in visually assessing sensor performance.

          3. Reduced resolution imagery data interface – TBD

        3. Navigation data interface – TBD
        4. Sensor pointing data interface – TBD
        5. Sensor command and control interface – TBD
        6. Sensor control shall be achieved via a MIL-STD-1553__ interface. Sensor control commands shall include at a minimum:

          a. Status Mode

          - Off

          - Standby

          - Operate

          - TBD

          b. Operate Mode

          - TBD

          c. Coverage Mode

          - TBD

          d. Spectral Mode

          - TBD

          e. INS information input

          - TBD

          f. TBD

           

        7. BIT requirements
          1. General
          2. To aid the ground and flight crews in assessing sensor functional performance and identifying system failures, the sensor Built-In-Test (BIT) capability shall include as a minimum: Operational Readiness Test (ORT), Periodic BIT (PBIT), and operator Initiated BIT (IBIT) as defined below. Tests may be accomplished using any combination of hardware and software. BIT shall be self-contained within the equipment to accomplish failure detection and isolation without the assistance of support equipment at O-level. BIT shall be designed for maximum utilization of the equipment’s functional circuits to accomplish its purpose. Failures which do not impact mission performance (e.g., BIT circuitry failures) shall not cause O-level BIT failure indications.

            When the equipment is in a NO-GO condition, as defined in the Interface Control Document (ICD), it shall not interfere with the proper operation of any interfacing equipment. When practical, the equipment should continue executing BIT in an attempt to recover from the failure.

            Failure or degradation of BIT circuitry shall not cause failure or degradation of any other operational performance function(s).

            BIT functions shall provide adequate information to allow equipment to establish and implement degraded modes of operation.

            All sensor BIT functions shall make its BIT status available to interrogations from the MUX bus.

             

            1. Operational Readiness Test
            2. ORT is defined as those verification tests that are run upon sensor power-up, that ensure that the sensor is capable of properly communicating and performing all sensor input/output. The ORT shall be executed autonomously each time the sensor transitions from a Power-Off state to a Power-On state. The sensor shall not communicate on the MIL-STD-1553 Bus or High Speed Interface until completion of the ORT. ORT shall not require any operator intervention. The performance of associated equipment shall in no way be degraded, or interfered with, by the execution of ORT. The ORT shall verify all circuitry that directly or indirectly affects the sensor data interfaces prior to the enabling and normal use of that interface. The sensor shall maintain all of its outputs in the power up states as defined in the sensor ICD, until the successful completion of ORT. The equipment shall be capable of identifying whether a power-up condition is occurring during a warm start or cold start, and performing levels of testing which are consistent with that condition. The ORT shall support the overall BIT Failure Detection, Failure Isolation, Failure Recording, Failure Reporting, and False Alarm Rate requirements described herein. The time required to complete ORT shall support the start-up time requirements and shall not exceed 3 minutes excluding equipment warm-up and cool down time.

               

            3. Periodic Built-In Test
            4. PBIT is defined as those verification tests that are executed periodically during the OFP. PBIT shall be a background operation during the equipment "OPERATE" mode. PBIT shall be designed to provide maximum operational capability and to provide rapid aircraft turnaround. Periodic BIT shall automatically execute subsequent to ORT or Initiated BIT being successfully run. The performance of associated equipment shall in no way be degraded, or interfered with, by the execution of PBIT. The execution of PBIT shall not affect sensor performance or require operator participation. PBIT shall support the overall BIT Failure Detection, Failure Isolation, Failure Recording, Failure Reporting, and False Alarm Rate requirements. The time required for Periodic BIT, to complete an evaluation of equipment performance and provide the results for transmission shall not exceed XX second. PBIT shall be non-interruptive in nature, and occur at TBD intervals/frequency. PBIT shall monitor the operational status of the equipment, and shall provide notification to the aircrew in the event that the equipment should fail, such that the mission could not be completed .

               

            5. Initiated Built-In Test

            IBIT is defined as those verification tests that are executed upon receipt of an external IBIT command. Initiated BIT performs a more complete set of BIT functions upon external command, to provide confidence that the equipment is operational during a pre-flight condition or to confirm the presence of a failure in-flight or in a post-flight condition. IBIT may interrupt normal system operation and may require operator participation. The performance of associated equipment will in no way be degraded, or interfered with, by the execution of IBIT. IBIT will support the overall BIT Failure Detection, Failure Isolation, Failure Recording, Failure Reporting, and False Alarm Rate requirements. In the Initiated Mode of operation, the time required for BIT to complete an evaluation of equipment performance and provide the results for transmission shall not exceed XXX seconds.

          3. BIT Interfaces
            1. BIT Inputs
            2. The sensor shall accept a Test Message from the RMS via the MIL-STD-1553 bus to control the Initiated BIT mode of operation. Unused bits in the message may be used for unique sensor tests.

            3. BIT Outputs

            The sensor shall provide a BIT reply message to the RMS via the MIL-STD-1553 bus to indicate equipment BIT status. Unused bits in the message may be used for unique sensor tests. The sensor shall provide a Sensor NO-GO in the function status word(s) which indicates an equipment failure has been detected that impacts the functional operation of the sensor (i.e., processor failure, memory failure, etc.). The sensor shall provide a Sensor Degrade in the function status word(s) which indicates that the sensor has detected a failure which does not impact the functional operation of the sensor (i.e., failures in redundant circuitry or non-critical functions). The equipment shall provide a Sensor NO-GO status in the function status if either the Sensor NO-GO or the Sensor Degrade function status bits are set.

          4. Fault Logs
          5. Failure Recording is defined as the non-volatile storing and organization of sensor and SRA Failure data along with related data necessary to meet the BIT requirements of paragraph 3.2.1.4. Failures shall be organized and stored in a table. The table shall consist of records that detail whether the failure was detected during an ORT, IBIT, or PBIT; the particular test that failed; the functional fail associated with the failed test; the failed SRA (if available); sensor supplied time totalizing meter; sensor supplied critical box temperature; and up to 20 aircraft parameters. The sensor supplied box temperature shall be the temperature of the equipment at a critical location in the box. The non-volatile memory shall be sized such that there is 50% spare failure memory left over after satisfying the storage requirements of this paragraph and any other overhead usage deemed necessary by the Supplier. Each set of memory locations shall be readable via an independent command signal via the MUX bus. The recording of Failures and related data shall meet full performance without the loss or corruption of stored data in the presence of power transients, series of power transients, unintended loss of power, or other such anomaly occurring during the write cycle of a Failure record. As a goal, failure recording shall store and make available, to the MUX bus, internal error conditions such as timeouts or other conditions that may not necessarily satisfy the criteria of a Failure but may aid in integration and debug of the equipment. The sensor shall provide a mechanism (i.e. checksum, CRC, etc.) of validating the integrity of the non-volatile Failure memory.

            Each sensor shall include a fault log in nonvolatile memory which is of sufficient size to redundantly store the following information for a minimum of five separate, most recent BIT failure events.//NEED TO LOOK AT

            (a) BIT mode during which the failure was detected.

            (b) BIT fault code(s).

            (c) Associated function fail data.

            (d) Failed sensor and subassembly (if available).

            (e) BIT filter parameters (M of N and persistence counts).

            (f) sensor supplied elapsed time indication.

            (g) sensor supplied critical box temperature.

            (h) sensor supplied electronic serial number, OFP and firmware identification.

            (i) Up to 20 environmental parameters supplied by the aircraft.//NEED TO LOOK AT

            Fault log contents shall be overwritten or erased only upon external command at the depot. Contents shall remain intact at power-up and any time BIT is rerun.//NEED TO LOOK AT

            The recording of fault log data shall be unaffected by series of power transients or other anomalies which occur during the write cycle of a failure record.

            The equipment shall provide an internal mechanism for validating the integrity of the non-volatile memory. Failures in the fault log memory shall not cause O-level BIT codes to be set.//NEED TO LOOK AT

             

          6. Elapsed Time Indication

The equipment shall include a digital solid state elapsed time circuit design (Time Totalizing Meter) capable of generating, recording, and storing elapsed time in nonresettable, nonvolatile memory. This circuit shall provide measurement and recording of total accumulated power-on time in one-tenth hour increments for not less than 99,999 hours. The stored time shall be accessible via a the MUX bus to display the total elapsed time on the cockpit displays or other suitable display with the equipment installed in the aircraft or on associated factory test equipment.

 

    1. Environmental Conditions
    2. The sensor shall survive, operate, and/or perform within the environments specified below.

       

      1. Operational Flight Envelope
      2. The SHARP sensor(s) shall survive (non-operating) throughout the limits of the basic aircraft (LBA) of the F/A-18E/F as defined in the F/A-18E/F NATOPS Flight Manual. In addition, the SHARP sensor(s) shall meet full performance requirements within the operating envelope summarized in table IV.

        TABLE IV. SHARP operating envelope

        Requirement

        Threshold

        Objective

        Minimum Speed (all missions)

        300 KGS

        200 KGS

        Maximum Speed (all missions)

        550 KGS

        600 KGS

        Minimum Altitude – Medium Altitude Overflight/Standoff

        2,500ft AGL

        2,000 ft AGL

        Maximum Altitude – Medium Altitude Overflight/Standoff

        20,000 ft AGL

        25,000 ft AGL

        Minimum Altitude – High Altitude Standoff

        20,000 ft AGL

        15,000 ft AGL

        Maximum Altitude – High Altitude Standoff

        45,000 ft AGL

        50,000 ft AGL

         

      3. Aircraft Maneuvering Environment
      4. The sensor shall survive and perform after the accelerations of table V are applied for a duration necessary to achieve the angular velocities in table V. The environments in table V are defined at the pod/aircraft mount structure interface.

        TABLE V. SHARP maneuvering envelope

        Environment

        Axis

        Angular Limits (deg)(1)

        Angular Velocities (deg/sec)

        Angular Accelerations(2) (deg/sec2)

        Non-operating

        Roll

        N/A

        LBA

        LBA

        Pitch

        N/A

        LBA

        LBA

        Yaw

        N/A

        LBA

        LBA

        Operating (without damage)

        Roll

        360

        270

        859

        Pitch

        + 90

        50

        172

        Yaw

        360

        50

        115

        Full Performance

        Roll

        + 30

        30

        60

        Pitch

        + 10

        20

        30

        Yaw

        + 10

        20

        10

        (1) Reduced by any platform line-of-sight obscurations.

        (2) At 0 degrees roll angle.

        "LBA" = to the Limits of the Basic Aircraft.

         

      5. Sensor Bay Environment
      6. The sensor shall operate within the range of the ECS in the F/A-18E/F SHARP system. The sensor shall have the capability of operating within the internal temperature, pressure and humidity within the pod during all phases of flight throughout the flight envelope, ground operation, and taxi and maintenance conditions. The sensor shall meet all specified requirements and shall provide required performance, life, and reliability under any natural combinations of the service conditions specified herein.

        1. Temperature – TBD
        2. The sensor shall operate to full performance in the SHARP pod within a temperature range from +4 to +32 degrees C, with a maximum rate of temperature change of + 0.14 C degrees per minute.

        3. Temperature shock – TBD
        4. The sensor shall survive and operate in the SHARP pod during maximum rate of temperature change of TBD C degrees per minute.

        5. Humidity – TBD
        6. The equipment design shall provide performance as specified herein and sustain no damage when subjected to a 100% humidity environment over its full temperature range. In addition, the equipment shall withstand without deterioration in performance or internal or external corrosion a humidity test consisting of 10, 24 hour cycles with 6 hours at 65oC and 95% to 100% relative humidity and 16 hours at 30oC and 80% relative humidity. Equipment operation shall be verified immediately after the 10 day exposure.

           

        7. Shock – TBD
          1. Service Shock.
          2. The equipment shall be designed to operate within specified performance requirements when subjected to the shock requirements of Figure XX.

          3. Crash Safety Shock.

          The equipment shall be designed to withstand crash safety shock requirements specified in Figure XX.

        8. Vibration – TBD
        9. The equipment shall be designed so that no fractures or permanent deformations shall occur, no fixed part or assembly shall become loose, no moving or movable part of an assembly shall become free or sluggish in operation, no movable part or control shall shift in setting, position, or adjustment, and so that the performance shall be within the requirements of this performance specification. Any applicable burn-in environmental stress screening vibration requirements shall be considered as additional to these vibration design requirements.

        10. Acoustic Noise – TBD
        11. The equipment shall fulfill specified requirements when subjected to the acoustic noise requirements identified in Figure XX.

        12. Fungus

        The equipment shall contain no nutrient materials that will support the growth of any fungus under any combination of temperature and humidity conditions specified herein.

      7. Electromagnetic Compatibility – TBD
      8. The sensor(s) must be electromagnetically compatible with itself and with the electronic systems and equipment installed both in the SHARP pod and onboard the host platform. The sensor(s) shall not be adversely affected or demonstrate performance degradation due to conducted and radiated electromagnetic energy from collocated systems. The sensor, as installed in the F/A-18E/F SHARP pod, shall comply with the system EMC requirements of MIL-E-6051D(1).

         

        1. Emission and Susceptibility Requirements.
        2. Generation of and susceptibility to electromagnetic interference shall be controlled within each unit of the equipment.

          1. MIL-STD-461 Requirements
          2. The equipment shall meet the requirements of MIL-STD-461, Navy Aircraft, as specified and/or modified herein and shall be compatible with the Carrier Deck EMI environment to the levels shown in Table V herein.

          3. Subsystem Test
          4. In accordance with 4.7 of MIL-STD-461 and for compliance verification, equipment consisting of more than one unit intended to be operated as a subsystem shall be tested together as a single system.
          5. Specific MIL-STD-461 Requirements
          The specific requirements and modifications of MIL-STD-461, as they apply to this equipment, are as follows:

          (Note: The use of filter pins to meet any of the following requirements must be approved by the procuring activity)

          CE102 CS101 CS114(1) RE102(2) RS103(3)

          (1) Curve 5 of Figure CS114-1.

          (2) RE102 upper frequency limit shall be 80 dBm V/m at 21 GHz.

          (3) The requirements for RS103 shall be met without and with metal overbraided cables. The levels of RS103 shall be as shown in Table V. The radiated field shall be modulated at 1 KHz 50% Duty Cycle.

          The filter requirement of 4.3 of MIL-STD-461 shall not apply to the procured equipment. Engineering developmental testing shall replace the requirements of Electromagnetic Interference Control Plan (EMICP).

        3. Relay Transient Immunity
        4. The equipment shall not exhibit any malfunctions or degradation of performance when all interconnecting and signal leads are subjected to an electromagnetically coupled relay switching transient.

        5. Ground Plane Noise Immunity
      No malfunction or degradation of performance shall be produced when noise signals in accordance with the following requirements are injected between the DMS chassis and aircraft ground.

      (a) Three volts RMS from 320 Hz to 500 Hz (not to exceed 10 Amps RMS).

      (b) One Volt RMS from 500 Hz to 50 KHz (not to exceed 10 Amps RMS)

      (c) 50 KHz to 100 MHz (not to exceed 1 Watt from a 50 ohm source)

      (d) +/- 8 volt pulses, 100 microseconds wide at 100 pps, 10 microseconds wide at 1000 pps, 5 microseconds wide at 1000 pps, and 0.15 microseconds wide at 50 pps. (not to exceed 1 Ampere RMS current).

      (e) +/- one volt DC (not to exceed 10 Amperes).

       

    3. Physical Characteristics – TBD
    4.  

      1. Electrical – TBD
      2.  

      3. Thermodynamics – TBD
      4.  

      5. Weight – TBD – (Raytheon – Indy)
      6.  

      7. Installation – TBD – (Raytheon – Indy)
      8.  

      9. Grounding, balancing, and interconnect requirements – TBD
        1. Grounding Requirements
        2. All sensors shall be electrically grounded in such a manner as to prevent ground loops and common ground returns for signal and power circuits, provide effective shielding for signal circuits to minimize EMI, and protect personnel from electrical hazards.

          1. Aircraft Grounding
            1. Chassis Ground
            2. A wire of minimum length connected internally to the sensor chassis shall be provided at a pin on each primary power connector.

            3. Additional Chassis Ground Requirements

            No circuit shall be allowed to utilize this wire as its primary return nor shall the chassis ground wire be attached to a grounded pin of a filter pin connector.

          2. 3.3.2.3.2 Primary Power Grounding.
            1. Primary Power Definition
            2. For grounding purposes, primary power is defined as electrical power which is conducted from aircraft bus power which is fused, switched, filtered, or attenuated.

            3. Primary Power Return
            4. A return for each source of primary power used in the sensor, whether connected to the internal chassis or not, shall be made available at a separate pin of each primary power connector.

            5. Power Return Leads

            Power return leads shall not be attached to the ground pin of a filter pin connector if used.

          3. Signal Grounding.
            1. Signal Definition
            2. A signal is defined as electrical energy which contains information.

            3. Signal Grounding Requirements
            4. The following requirements apply to the electrical interfaces among sensors.

            5. Shared Return Lines. TBD.
            6. Signal Isolation
            7. To ensure adequate rejection of the aircraft chassis noise, signal circuits shall be referenced to chassis ground in a manner that insures compatibility with the aircraft noise levels of 3.3.2.1.2.2.

            8. Unbalanced Signal Sources. TBD.
            9. Signals Feeding Unbalanced Loads. TBD.
            10. Impedance Matching of High Frequency Signals

            Signals, whose fundamental frequency is above two MHz, shall be impedance matched to the transmission line.

          4. Shield Grounding
          5. Cable overbraid used on external cables for EMI suppression will be grounded through EMI backshells to the equipment chassis. If additional individual wire shields are also provided in the cable, a separate connector pin shall be provided for each wire shield. The connector shield pins shall be grounded to the equipment chassis inside the equipment adjacent to the connector mounting and by the shortest means practicable. A filter pin connector may also be used (if approved by the procuring activity) to ground the individual wire shields.

          6. Component Grounding
          7. All externally exposed metal parts, shields, control shafts, switch handles, connectors, bushings, etc. shall be grounded to the chassis.

          8. Interconnect Wire Shielding
          9. The use of shielded wiring and cables for sensor interconnect is discouraged. Compliance with MIL-STD-461 and MIL-STD-462 is not adequate justification for wire or cable shielding. Wire or cable shielding shall be used only for aircraft compatibility or circuit functional requirements.

          10. DMS A/C Bonding Requirement
          11. The DMS shall have a means of creating and maintaining an electrical bond of 2.5 milliohms between an established fixed point on the equipment and the pod.

            1. Bonding Installation Process
            2. This bonding design will be an integral part of the installation process. No additional steps in the installation process shall be required to establish proper bonding.
            3. Equipment Bonding Requirement
            4. The electrical bonding resistance between the established fixed point and all exposed conducting parts of the equipment case shall not exceed 2.5 milliohms.
            5. Shielding Gaskets
            If an RF shielding gasket is used, the gasket and surrounding surfaces shall be designed such that corrosion will not degrade the EMI performance of the seal over the life of the equipment.
          12. 3.3.2.3.8 Device Sensitive to Electrostatic Discharge.
            1. ESD Design Features. TBD.
            2. ESD Requirements for Electrical Interfaces. TBD.

         

      10. Aerodynamics – TBD
      11.  

      12. Survivability – TBD
      13.  

      14. Design and Construction – TBD
      15. Design and construction of the equipment will meet all requirements of this specification.

        1. Materials, Processes and Parts.
        2. Materials, processes and parts will meet the requirements specified herein.

          1. Materials.
            1. Sealing Materials (Electrical)
            2. Encapsulating and potting materials shall be hydrolytically stable. Conformal coatings shall be used.

            3. Material Selection Limitation
            4. All organic materials having ester linkages shall have been tested for hydrolytic stability.

            5. Chemical Resistance

            All materials shall be selected such that no functional degradation or material deterioration shall occur following exposure to fluids commonly used in and around military aircraft and maintenance and storage facilities. These fluids include:

            Fuel

               

            MIL-T-5624 Grade JP-4

            Acetone

            O-A-51

            MIL-T-5624 Grade JP-5

               

            MIL-T-83133 Grade JP-8

            Thinner

            MIL-T-81772

            ASTM D-1655

               

            JET A

               

            JET A-1

               

            JET B

               

            Oil

               

            MIL-L-23699

               

            DOD-L-85734

               

            Hyd Fluid

               

            MIL-H-83282

               

            MIL-H-8506

               

            Dry-cleaning Solvent

               

            P-D-680 Type II

               

            Isopropyl Alcohol

               

            TT-I-735

               

            Cleaning Compound

               

            MIL-C-85570

               

            MIL-C-29608

               
                 

          2. Processes
            1. Finish and Colors
            2. The equipment and parts thereof shall be finished to withstand the environment required in this specification without showing signs of corrosion after pretreating the surface of cases, boxes, etc.

            3. Soldering

            Design and manufacturing processes shall be in accordance with ANSI/J-STD-001A.

          3. Parts
            1. Fasteners
            2. Screws used to attach the equipment to the aircraft shall be size 3/16 inch in diameter or larger unless specified otherwise herein. Fasteners requiring the use of tools other than standard Navy issue hand tools shall not be used in the equipment.

            3. Electrical Connectors
            4. The unit external connectors, used to interface with aircraft wiring, shall be of the following type (or equivalent):

              a. Miniature Circular, Environmental Resisting

              b. Coaxial, triaxial, and fiber optical connectors shall be coordinated with SHARP IPT on an individual basis via the Interface Control Sheets in the SDL.

              c. Filter pin connectors shall be approved by the SHARP IPT in writing via the Interface Control Sheets in the SDL.

              (1) The filter shall be non-removable from the connector.

              (2) The RF current rating of 4.14 shall be 3.0 Amperes.

              (3) Only frequency band F of Table I shall apply.

              (4) All pins passing through a filter pin connector shall be either filtered or grounded except for coaxial or triaxial signal lines.

              (5) Bent pin conditions shall be considered for all pin assignments. The assignment/arrangement of pins shall be coordinated with and approved by SHARP IPT in writing via the external wiring diagram in the SDL.

              Quantities, types, mounting methods and location, and clocking of the polarizing keys shall be coordinated with and approved by the SHARP IPT in writing. Spare pin assignments shall be coordinated with and approved in writing by the SHARP IPT.

              sensor connectors shall be selected to mate with the following:

              No.

              Designation

              Part No.

              Shell Size

              Contacts

              J1

              Primary Power

              MS27467T11B35S

              11

              13 #22D

              J2

              High Speed Interface

              HFN 1045

              11

              4 #22D

              J3

              Video Channel A

              5M1749-21B75PN

              21

              4 #8 Triax

              J4

              Discrete I/O

              MS27467T17B35P

              17

              55 #22D

              J5

              Video Channel B

              5M1749-21B75PA

              21

              4 #8 Triax

                       

            5. Parts Derating
            6. All electronic and electrical parts shall be electrically and thermally derated in application. The derating levels shall be consistent with the reliability and life requirements of paragraph 3.2.3. The derating shall be applied at the worst stress conditions of cooling for standard, normal or ground or fan cooling of section 3.2.1.5.2.3.

              In addition, semiconductor and microcircuit junction temperatures shall not exceed 110 degrees C. All components shall apply derating at 57 degrees C sea level ambient and, if applicable, with an inlet temperature of per the standard cooling conditions of paragraph 3.2.1.5.2.3 for forced air or 32 degrees C for cockpit fan cooled air. Nominal unit and SRA power dissipation and the worst case steady state piece part stresses shall be used for derating compliance. Digital gallium arsenide (GA) components shall be limited to a maximum junction temperature of 150 degrees C and high power/high frequency GA components shall be limited to a maximum junction temperature of 200 degrees C.

            7. Diodes
            8. Diodes which interface with external wiring and diodes that are used for coil suppression shall have an 600 Peak Inverse Voltage (PIV) rating or higher.

            9. Surface Mount Technology (SMT)
            10. The design of the equipment using surface mount technology shall meet a minimum of one service life.

              Printed circuit boards (PCB) using surface mount technology shall be designed to survive thermal cycling and vibration exposure for the service life. Leaded and leadless surface mount component solder joints, PCB plated through holes and vias shall provide a Miner’s cumulative damage ratio not more than 0.50 due to effects of thermal cycling and vibration over the service life exposure. The thermal cycle service life is defined by Table IV and the vibration qualification endurance requirements establish the vibration service life.

              The solder joint analyses shall be supported by solder joint life testing on similar components, board materials and construction processes.

            11. Solder Joint Reliability
        The vendor shall verify that the solder interface can survive the specified environments without fatigue cracking. The cumulative fatigue damage ratio (number of cycles expected in one life time divided by the number of calculated cycles to failure) for solder joints must be less than 0.50. Standard thermal and vibration transforms (e.g., Steinberg, Manson Coffin) may be used to verify compliance. The analyses shall be supported by solder joint life testing.

      16. Equipment identification – TBD
      17. Interchangeability – TBD
      18. Color – TBD
    5. Integrated Logistics and Support
      1. Support Equipment
      2. Storage Containers

      The sensor storage container(s) shall be designed to protect the sensor from shock and vibration which may occur during standard navy handling procedures. In addition, the sensor storage container(s) shall seal out harsh environments such as humidity, salt spray, sand, etc… such as may occur during storage, and transportation.

    6. Safety
    7. Appropriate Industrial and Occupational Safety Health standards shall be incorporated into the system design. All operations and maintenance manuals will comply with MIL-STD-882 Series.

    8. Security
    9. Physical security will be provided during development, testing and production commensurate with that to be provided at operational bases. The system will not require additional physical security beyond that already dedicated to tactical aircraft operating areas.

    10. Information Security
    11. Security classification will be as contained in latest issue of OPNAVINST C5513.2C-26. Classified computer systems shall meet TEMPEST requirements. Sensitive information will be handled per DoD Directive 5400.7R

    12. Human Factors Engineering - TBD
    13. Non-development Items – TBD

Maximum use thereof.

  1. VERIFICATION – TBD
  2. Performance inspections shall be performed to verify that all requirements of Section 3 have been achieved.

    1. Verification Methods

The requirements specified in Section 3 shall be verified by the following methods.

    1. Drawing Review – A review of applicable drawings and subsystem specification shall be conducted to show compliance with the requirements.
    2. Analysis – An analysis of test data, computer simulations, circuit components and structural design shall be performed to show compliance with the requirements.
    3. Inspection – Inspections shall be conducted to show compliance with the requirements. Inspections shall consist of a review of applicable drawings, visual examination, physical or electrical measurements of the system subassemblies, units, or components prior to system test.
    4. Demonstration – Demonstrations shall be conducted to show compliance with the requirements.
    5. System Test – A system acceptance test shall be performed to show compliance with the requirements. System testing shall consist of monitoring and simulating electrical or other parameters to ensure compliance with applicable specification requirements.
    6. Ground and Flight Tests – Ground and flight tests shall be conducted to show compliance with the requirements.
    7. Environmental Tests – Environmental tests shall be conducted to show compliance with the requirements.
    8. Configuration audits – Functional and physical configuration audits shall be conducted on the SHARP sensors.
    9. Similarity – Compliance with the requirements of this specification shall be verified by similarity to existing qualified equipment when appropriate.

 

    1. Inspections
    2. Physical characteristics
      1. Physical dimensions
        1. Weight
        2. Mounting interface
        3. Grounding
        4. Safety
        5. Physical security
        6. Sensor optical characteristics
    3. Performance tests
      1. Electrical Interface tests
      2. Environmental tests
      3. Imaging performance
  1. PACKAGING
  2. NOTES
    1. Intended Use
    2. Acquisition Requirements