Annex E. International Armaments Strategy
Army Science and Technology Master Plan (ASTMP 1997)


2. Development of Indium Compounds for MMIC/MIMIC (Germany)

Description: Future electronic systems demand increasingly smaller, faster, and cheaper microelectronic devices. Devices based upon silicon technology (such as VHSIC--Very High Speed Integrated Circuits) have reached a point at which components cannot be manufactured at significantly smaller sizes.

Justification: The use of MIMIC technology will contribute directly to the development of powerful multi-purpose single monolithic chips for sensors, processors, and millimeter wave phased array antennas. To meet future requirements, compound semiconductors are necessary. While Japan, France, and Germany are world leaders in compound semiconductors, Germany has developed a specific niche in Indium compounds. German contributions to microwave and photonic devices could be significant if initial projections can be realized in production devices.

Implementation: An active DEA exists with Germany and could serve as a vehicle for the exchange of information to support ASTMP objectives.

AMC POC:

Dr. Rodney Smith
Army Materiel Command
AMXIP-OB
5001 Eisenhower Blvd
Alexandria, VA 22333-0001
e-mail: icpa@hqamc.army.mil

IPOC:

Ms. Annette Chomsky
US Army CECOM
ATTN: AMSEL-RD-AS-TI
Ft. Monmouth, NJ. 07703
e-mail: chomsky@doim6.monmouth.army.mil